Bambu Cool Plate
Bambu Cool Plate
Bambu Cool Plate
Bambu Cool Plate Bambu Cool Plate Bambu Cool Plate

Bambu Lab

Bambu Cool Plate

SKU: FAP001+FAP003

¥4,080 円

税込価格

Compatibility:
Quantity:
¥4,080 円
注文について
  • 日本国内倉庫から、２営業日以内発送
  • 配送につき、配送規約をご確認頂けます
  • 製品の保証につき保証規約をご確認頂けます

Things to know before use

 

  • Variations in the color and luster of the Engineering Plate appearance and the removal of the exposed metal areas are just minor adjustments to optimize the production process and surface quality. If the coating remains on the nozzle when the nozzle is wiped, it will be heated and melted before printing the model. Such changes do not affect leveling, Lidar, adhesion, or range of use. You can purchase with confidence!

  • Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.

  • Bambu Lab recommends only using Bambu Lab official glue on the Cool Plate, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates.

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    Bambu Cool Plate Bambu Cool Plate
    Bambu Cool Plate Bambu Cool Plate

    Overview

     

  • The Bambu Cool Plate is a sticker that is applied to the Bambu Engineering Plate. This is a consumable printing surface that is used in conjunction with a thin coat of glue stick and works best for filaments with a low heat deflection temperature

  • The Bambu Cool Plate leaves a smooth finish to printed models that come in contact with the Cool Plate and might require a bit of post-processing for cleaning up the glue stick.

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    Recommended Settings for Bambu Cool Plate

    Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements

    Hotbed Temperature Glue Stick Required? Upper Glass Cover Plate Removed?
    PLA/PLA-CF/PLA-GF 35~45℃ Yes Either
    TPU 30~35℃ Yes Either
    PVA 35~45℃ Yes Either

    Benefits

    Works best with low glass transition temperature filaments as it can be used at a low temperature for the hotbed

    Works well with the Automatic Calibration for Flow rate and does not interfere with the LIDAR

    Smooth texture on the surface of the print

    Excellent adhesion and easy print removal

    Can be replaced by the user

    Downsides

    Cannot be used without glue stick as the surface can be easily damaged if glue stick is not used

    It is not recommended for high-temperature materials as bubbles can form underneath the print surface and cause damage

    Can be more fragile compared to the Engineering Plate or Textured PEI Plate



    Recommended Settings for Bambu Engineering Plate

    Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements

    Hotbed Temperature Glue Stick Required? Upper Glass Cover Plate Removed?
    TPU 30~35℃ Recommended No
    PETG 70~80℃ Recommended Yes
    ABS 100~110℃ Yes No
    PC/PC-CF 100~110℃ Yes No
    PA/PA-CF/PATH-CF 100~110℃ Yes No

    Installation Steps

    Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you

    Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you

    Step 2: Lower the plate and secure to the magnetic platform Step 2: Lower the plate and secure to the magnetic platform

    Step 2: Lower the plate and secure to the magnetic platform


    Product Specification

    Surface temperature resistance Up to 120℃ Usable print size 256*256 mm
    Flexible spring steel thickness 0.5 mm Cool Plate sticker thickness 0.4 mm
    Package Weight 320 g Package size 290*290*4 mm