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Support for PLA (New Version)

SKU: S02-W1-1.75-500-SPL

¥3,280 円

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特徴
  • 簡単に取り外し可能
  • 細部まで保護
  • サポートインターフェース用に最適
  • 基本的な再利用可能スプール付き
  • 直径:1.75 mm ±0.05mm
ご利用時の注意事項
  • サポート部分の印刷専用、独立したモデルには使用しない
  • AMS & AMS lite対応

Color: White (65104)
Type:
Size:
Description:
Quantity:
¥3,280 円


  • 日本国内倉庫から2営業日以内出荷(配送規約はこちら
  • 14日間の返品・返金サービス(保証規約はこちら
  • 安心保証期間(保証規約はこちら
  • 充実のサポート体制

 

Bambu Support for PLA

Bambu Support for PLA is fully compatible with all Bambu Lab PLA filaments and Bambu Lab printers, offering effortless peel-off removal, smooth interface quality, with reliable performance. It eliminates the need for post-processing, saving time while delivering flawless results. All at a budget-friendly price. Upgrade your 3D printing experience today!

Support for PLA Filament Support for PLA Filament

Effortless Removal

Bambu Support for PLA is specifically designed for PLA filaments, ensuring clean, residue-free removal by hand. Say goodbye to post-processing and enjoy a seamless 3D printing experience.




 

Preserve Every Detail

With optimized support interface settings* in Bambu Studio, Bambu Support for PLA delivers an ultra-smooth contact surface that protects intricate details as if untouched. Perfect for delicate designs, overhangs, and bridges, it ensures premium quality from start to finish.

* 0mm top interface spacing and 0mm Z-distance settings

Support for PLA Filament Support for PLA Filament

Affordable Support, Premium Performance

Bambu Support for PLA delivers enhanced performance at 33% less cost than its predecessor. Enjoy greater stability, improved printability, and better results, all while saving money.

Support for PLA Filament Support for PLA Filament

Use for Support Interface

Activate the "Support/raft interface" setting in Bambu Studio to apply support material exclusively to contact surfaces. This approach minimizes material usage, saving both time and money.




 

RFID for Intelligent Printing

All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).

Load and print! No more tedious setting steps.

rfid rfid

 

 

Accessory Compatibility

Recommended Not Recommended
Build Plate
Cool Plate SuperTack, Smooth PEI Plate, Textured PEI Plate
/
Hotend All Size / Material /
Bambu Liquid Glue / Glue Stick Bambu Liquid Glue / Glue Stick /

 

Recommended Printing Settings
Drying Settings (Blast Drying Oven) 55 °C, 8 h
Printing and Keeping Container's Humidity < 20% RH (Sealed, with Desiccant)
Nozzle Temperature 220 - 230 °C
Bed Temperature (with Glue) 35 - 45 °C
Printing Speed < 200 mm/s
Physical Properties
Density 1.33 g/cm³
Vicat Softening Temperature N / A
Heat Deflection Temperature N / A
Melting Temperature 190 °C
Melt Index 13.6 ± 1.2 g/10 min
Mechanical Properties
Tensile Strength N / A
Breaking Elongation Rate N / A
Bending Modulus N / A
Bending Strength N / A
Impact Strength N / A

 

Printing Tips

• For large flat surfaces, use the "normal" support type with the "Default" style for optimal results. For complex models, choose the "tree" support type with the "Tree Hybrid" style. For more details, visit the  Support on WIKI.

Support for PLA Filament Support for PLA Filament
Support for PLA Filament Support for PLA Filament

• It is recommended to dry the Support for PLA before printing and keep it sealed in the AMS with desiccant throughout the printing process to optimize the print quality.

• Drying Conditions:

In a blast drying oven: 55°C for 8 hours.

On an X1 printer and H2D printer's heatbed: 65°C to 75°C for 12 hours.

AMS 2 Pro and AMS HT: 60°C for 12 hours.

• For more filament drying settings, please refer to Filament Drying Recommendations on WIKI.

What's in the Box

Filament with Spool*1 & Desiccant*1

图片加载失败文案 图片加载失败文案

Package*1

 

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